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金刚石切割碟

上海益朗仪器有限公司

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价格：电议

所在地：上海

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更新时间：2024-03-19

浏览次数：3512

公司地址：临夏路256号上海电子商城5号楼904室

13701600767 丁成峰(先生) 经理

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产品简介

美国EXTEC含钻石微粒切割碟：有高密度和低密度两种，直径有76mm,102mm,127mm,152mm,178mm.高密度适合经常切割金属及陶瓷；低密度适合切

公司简介

我司是精密测试仪器代理商，为在中国独家代理美国Thermo-Electron X-射线测厚仪及德国ROENTGENANALYTIK Compact eco系列X-射线测厚仪。此两种仪器主要用于镀层或涂层厚度的测量，而且特别适合于对微细表面积或超薄镀层的测量。以下我们公司其他主要产品：　　新加坡QTEST CIMS 特性阻抗测试仪　　韩国Micro Pioneer XRF-2000系列测厚仪　　美国Solar Metrology 太阳能薄膜电池厚度测量仪　　日本KYORITSU WAK-水质离子测试包　　美国WALCHEM（禾威）电镀药液自动添加系统　　美国OMEGA 600SMD离子污染测试仪　　美国UPA / VEECO非破坏性厚度测试仪　　美国EXTEC研磨 / 抛光器材及消耗品　　英国JENWAY分光光度计　　美国Kocour库仑测厚仪、侯氏槽、阴/阳极片、离心机等　　德国SCAN-DIA研磨 / 抛光器材及消耗品　　美国INNOV-X伊诺斯RoHS分析仪(手提式:XRF 6500，台式:Ray-tek1800) 　　美国ECI电镀药液分析系统　　美国DICKSON/DeltaTRAK/OMEGA温湿度记录仪　　日本SHIMADZU(岛津)分光光度计、X射线荧光分析仪　　日本IWAKI工业用泵　　韩国K-Mac ST4080-OSP 光学测厚仪　　美国SPELLMA******??电源供应器　　日本KETT磁感/涡流涂层测试仪　　俄罗斯INTRON PTH-1/ITM-52手提式线路板孔铜测厚仪　　美国RPS可焊性测试仪　　美国UNITRON工业用显微镜系统及表面光滑度测试仪　　美国EXTECH多用途万用表　　美国CECO板材厚度测试仪、铜箔剥离强度仪　　一直致力于为PCB厂商，电镀行业，科研机构，半导体生产等电子行业提供高性能的仪器和优质的售后服务。【shanghai yilang yiqi youxiangongsi】

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产品说明

美国EXTEC含钻石微粒切割碟：有高密度和低密度两种，直径有76mm,102mm,127mm,152mm,178mm.高密度适合经常切割金属及陶瓷；低密度适合切割容易损坏的物料。
建议切割时添加冷却液或清水可减低切割时间及增加切割度

EXTEC Diamond Wafering Blades are available in high or low concentration in 3" (76 mm), 4"(102 mm), 5" (127 mm), 6" (152 mm), 7" (178 mm) and 8” (203 mm) diameters. High concentration is designed for routine use with most metals and ceramics. Low concentration is recommended for brittle materials such as ceramics, glass, carbides and other heat
resistant materials. EXTEC EP Wafering Blades are specifically manufactured for soft and gummy materials. EXTEC I CBN (Cubic Boron Nitride) Wafering Blades are preferred for Iron and Cobalt Base Alloys, Nickel Base Super Alloys and Lead Base Alloys. DW Diamond Wafering Blades or AC Advanced Ceramic Diamond Wafering Blades come complete with a Dressing Stick. EP Diamond Wafering Blades do not require a Dressing Stick. EXTEC Universal or EXTEC Water Soluble Cutting Fluid is recommended for precision cutting and reduced cutting time.

12043 EXTEC AC Dressing Stick 1” x 1/2” x 3” (25.4 mm x 12.7 mm x 76 mm)
12045 EXTEC DW Dressing Stick 1” x 1/2” x 3” (25.4 mm x 12.7 mm x 76 mm)
12050 EXTEC Universal Cutting Fluid
12052 EXTEC Universal Cutting Fluid
12065 EXTEC Water Soluble Cutting Fluid
12067 EXTEC Water Soluble Cutting Fluid
EXTEC Diamond Wafering Blade, High Concentration
Recommended for: metal matrix composites, titanium, thermal spray coatings, printed circuit boards, bones
12200 3" Dia. x 0.006" Thickness x 1/2” Arbor (76 mm x 0.15 mm x 12.7 mm)
12205 4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm)
12210 5" Dia. x 0.015" Thickness x 1/2” Arbor (127 mm x 0.4 mm x 12.7 mm)
12215 6" Dia. x 0.020" Thickness x 1/2” Arbor (152 mm x 0.5 mm x 12.7 mm)
12220 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12218 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)
EXTEC Diamond Wafering Blade, High Concentration
Recommended for: aggressive cutting, ferrous and non-ferrous materials
12252 5" Dia. x 0.020" Thickness x 1/2” Arbor (127 mm x 0.5 mm x 12.7 mm)
12253 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12254 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)
EXTEC EP Diamond Wafering Blade, High Concentration
Recommended for: polymers, rubber, soft gummy materials
12222 4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm)
12224 5" Dia. x 0.015" Thickness x 1/2” Arbor (127 mm x 0.4 mm x 12.7 mm)
12226 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12228 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)
EXTEC Diamond Wafering Blade, Low Concentration
Recommended for: ceramics, glass, alumina, zirconia, concrete, electronic substrates
12230 3" Dia. x 0.006" Thickness x 1/2” Arbor (76 mm x 0.15 mm x 12.7 mm)
12235 4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm)
12236 4" Dia. x 0.020" Thickness x 1/2” Arbor (102 mm x 0.5 mm x 12.7 mm)
12240 5" Dia. x 0.015" Thickness x 1/2” Arbor (127 mm x 0.4 mm x 12.7 mm)
12245 6" Dia. x 0.020" Thickness x 1/2” Arbor (152 mm x 0.5 mm x 12.7 mm)
12250 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12248 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)
EXTEC Diamond Wafering Blade, Low Concentration
Recommended for: structural ceramics, boron nitride, silicon nitride
12257 5" Dia. x 0.020" Thickness x 1/2” Arbor (127 mm x 0.5 mm x 12.7 mm)
12258 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12259 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)
EXTEC AC (Advanced Ceramic) Diamond Wafering Blade, Low Concentration
Recommended for: medium ceramics, GaAs, AIN, glass fiber composites, electron packages
12190 3" Dia. x 0.006" Thickness x 1/2” Arbor (76 mm x 0.15 mm x 12.7 mm)
12192 4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm)
12194 5" Dia. x 0.020" Thickness x 1/2” Arbor (127 mm x 0.5 mm x 12.7 mm)
12196 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12198 8" Dia. x 0.025" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)
EXTEC Diamond Wafering Blade, Low Concentration
Recommended for: soft friable ceramics, composites with fine reinforcing media CaF, MgF, carbon composites
12193 3" Dia. x 0.006" Thickness x 1/2” Arbor (76 mm x 0.15 mm x 12.7 mm)
12195 5" Dia. x 0.015" Thickness x 1/2” Arbor (127 mm x 0.4 mm x 12.7 mm)
EXTEC I CBN (Cubic Boron Nitride) Wafering Blade, Low Concentration
Recommended for: iron and cobalt based allows, nickel based super alloys and lead based alloys
12345 3" Dia. x 0.006" Thickness x 1/2” Arbor (76 mm x 0.15 mm x 12.7 mm)
12350 4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm)
12355 5" Dia. x 0.015" Thickness x 1/2” Arbor (127 mm x 0.4 mm x 12.7 mm)
12260 6" Dia. x 0.020" Thickness x 1/2” Arbor (152 mm x 0.5 mm x 12.7 mm)
12265 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12268 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)

美国EXTEC研磨切割碟 ABRASIVE CUT-OFF WHEELS
样品切割碟，边缘以优质的材料制成，附设直径6''(152mm)7''(178mm)9''(229mm)10''(254mm)12''(305mm)14''(356mm)。切割坚硬，中等硬度，较软的金属，含铁合金及钢时，建议使用氧化铝 (Al2O3)切割碟，碳化硅 (SiC)切割碟适用于中等硬度及较软而不含铁的金属，坚硬而不含金属的混合物，钛合金及制陶等

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